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Copy pathWafer_Vertical17.5x5.8x7RM2.5-6.kicad_mod
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Wafer_Vertical17.5x5.8x7RM2.5-6.kicad_mod
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(module Wafer_Vertical17.5x5.8x7RM2.5-6 (layer F.Cu) (tedit 556C2AA9)
(descr "Gold-Tek vertical wafer connector with 2.5mm pitch")
(tags "wafer connector vertical")
(fp_text reference REF** (at 6.2865 -3.81) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Wafer_Vertical17.5x5.8x7RM2.5-6 (at 6.2865 5.08) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.75 -2.75) (end 15.2 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 15.2 -2.75) (end 15.2 3.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 15.2 3.8) (end -2.75 3.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.75 3.8) (end -2.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 15.0495 3.429) (end -2.4765 3.429) (layer F.SilkS) (width 0.15))
(fp_line (start -2.4765 -2.413) (end 15.0495 -2.413) (layer F.SilkS) (width 0.15))
(fp_line (start 15.0495 -2.413) (end 15.0495 3.429) (layer F.SilkS) (width 0.15))
(fp_line (start -2.4765 -2.413) (end -2.4765 3.429) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole rect (at 0 0) (size 2 2) (drill 1.2) (layers *.Cu *.Mask F.SilkS))
(pad 2 thru_hole circle (at 2.5365 0) (size 2 2) (drill 1.2) (layers *.Cu *.Mask F.SilkS))
(pad 3 thru_hole circle (at 5.0365 0) (size 2 2) (drill 1.2) (layers *.Cu *.Mask F.SilkS))
(pad 4 thru_hole circle (at 7.5365 0) (size 2 2) (drill 1.2) (layers *.Cu *.Mask F.SilkS))
(pad 5 thru_hole circle (at 10.0365 0) (size 2 2) (drill 1.2) (layers *.Cu *.Mask F.SilkS))
(pad 6 thru_hole circle (at 12.5365 0) (size 2 2) (drill 1.2) (layers *.Cu *.Mask F.SilkS))
(model Connect.3dshapes/Wafer_Vertical17.5x5.8x7RM2.5-6.wrl
(at (xyz 0 0 0))
(scale (xyz 4 4 4))
(rotate (xyz 0 0 0))
)
)